Warning

Your browser does not currently support JavaScript. It is possible that some feature will not work. JavaScript is required for the online shop to function fully. Here are the instructions on how to enable JavaScript in your web browser.

Standards JIS - Japanese technical standards - Page 335

JIS covers industrial and mineral products, comparable to standards established by various industrial associations for specific needs, or standards established and used by companies (operation manuals, products specifications etc.). The need for common practices in companies of the same industrial sector leads to the establishment of industrial association standards, and the same need in terms of wider applications promotes the establishment of JIS.

Price display: excl. VAT

Displayed currency: USD

Sort by:

Narrow the selection for the "JIS - Japanese technical standards - Page 335" by:

Enter the number of the standard or the text which you are looking for:

Publication year

Valid (11691)

Invalid (0)

JIS C5630-1:2017

Semiconductor devices -- Micro-electromechanical devices -- Part 1: Terms and definitions

Standard published on 21.3.2017

Selected format:

Japanese -

electronic design (pdf) (ON REQUEST)

Show all technical information.

ON REQUEST

IN STOCK

JIS C5630-12:2014

Semiconductor devices -- Micro-electromechanical devices -- Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

Standard published on 20.2.2014

Selected format:

Japanese -

electronic design (pdf) (ON REQUEST)

Show all technical information.

ON REQUEST

IN STOCK

JIS C5630-13:2014

Semiconductor devices -- Micro-electromechanical devices -- Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

Standard published on 20.2.2014

Selected format:

Japanese -

electronic design (pdf) (ON REQUEST)

Show all technical information.

ON REQUEST

IN STOCK

JIS C5630-18:2014

Semiconductor devices -- Micro-electromechanical devices -- Part 18: Bend testing methods of thin film materials

Standard published on 22.12.2014

Selected format:

Japanese -

electronic design (pdf) (ON REQUEST)

Show all technical information.

ON REQUEST

IN STOCK

JIS C5630-19:2014

Semiconductor devices -- Micro-electromechanical devices -- Part 19: Electronic compasses

Standard published on 22.12.2014

Selected format:

Japanese -

electronic design (pdf) (ON REQUEST)

Show all technical information.

ON REQUEST

IN STOCK

JIS C5630-2:2009

Semiconductor devices -- Micro-electromechanical devices-- Part 2: Tensile testing method of thin film materials

Standard published on 20.3.2009

Selected format:

Japanese -

electronic design (pdf) (ON REQUEST)

Show all technical information.

ON REQUEST

IN STOCK

JIS C5630-20:2015

Semiconductor devices -- Micro-electromechanical devices -- Part 20: Gyroscopes

Standard published on 20.11.2015

Selected format:

Japanese -

electronic design (pdf) (ON REQUEST)

Show all technical information.

ON REQUEST

IN STOCK

JIS C5630-26:2017

Semiconductor devices -- Micro-electromechanical devices -- Part 26: Description and measurement methods for micro trench and needle structures

Standard published on 20.10.2017

Selected format:

Japanese -

electronic design (pdf) (ON REQUEST)

Show all technical information.

ON REQUEST

IN STOCK

JIS C5630-28:2020

Semiconductor devices -- Micro-electromechanical devices -- Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

Standard published on 23.3.2020

Selected format:

Japanese -

electronic design (pdf) (ON REQUEST)

Show all technical information.

ON REQUEST

IN STOCK

JIS C5630-3:2009

Semiconductor devices -- Micro-electromechanical devices-- Part 3: Thin film standard test piece for tensile testing

Standard published on 20.3.2009

Selected format:

Japanese -