Standards JIS - Japanese technical standards - Page 340

Semiconductor devices -- Micro-electromechanical devices-- Part 2: Tensile testing method of thin film materials

Standard published on 20.3.2009

Semiconductor devices -- Micro-electromechanical devices -- Part 20: Gyroscopes

Standard published on 20.11.2015

Semiconductor devices -- Micro-electromechanical devices -- Part 26: Description and measurement methods for micro trench and needle structures

Standard published on 20.10.2017

Semiconductor devices -- Micro-electromechanical devices -- Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

Standard published on 23.3.2020

Semiconductor devices -- Micro-electromechanical devices-- Part 3: Thin film standard test piece for tensile testing

Standard published on 20.3.2009

Semiconductor devices -- Micro-electromechanical devices -- Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

Standard published on 23.3.2020

Semiconductor devices -- Micro-electromechanical devices -- Part 6: Axial fatigue testing methods of thin film materials

Standard published on 22.8.2011

Dependability management -- Part 3-1: Application guide -- Analysis techniques for dependability -- Guide on methodology

Standard published on 20.11.2006

Dependability management -- Part 3-2: Application guide -- Collection of dependability data from the field

Standard published on 20.3.2008

Dependability management -- Part 3-3: Application guide -- Life cycle costing

Standard published on 20.3.2008