E DIN IEC 60191-6-5:..
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DIN EN 60191-6-19:2010-10
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage.
STANDARD published on 1.10.2010
The information about the standard:
Designation standards: DIN EN 60191-6-19:2010-10
Publication date standards: 1.10.2010
SKU: NS-236837
The number of pages: 15
Approximate weight : 45 g (0.10 lbs)
Country: German technical standard
Category: Technical standards DIN
The category - similar standards:
Annotation of standard text DIN EN 60191-6-19:2010-10 :
Mechanische Normung von Halbleiterbauelementen - Teil 6-19: Messverfahren für die Gehäuse-Verbiegung bei erhöhter Temperatur und die maximal zulässige Verbiegung.
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