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Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP).
STANDARD published on 1.5.2002
Designation standards: DIN EN 60191-6-8:2002-05
Publication date standards: 1.5.2002
SKU: NS-236846
The number of pages: 14
Approximate weight : 42 g (0.09 lbs)
Country: German technical standard
Category: Technical standards DIN
Electrical and electronics engineering drawingsMechanical structures for electronic equipment
Mechanische Normung von Halbleiterbauelementen - Teil 6-8: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Konstruktionsleitfaden für Glas-Keramik-Quad-Flatpack (G-QFP);.
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