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Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength.
STANDARD published on 1.1.2011
Designation standards: DIN EN 60749-19:2011-01
Publication date standards: 1.1.2011
SKU: NS-237802
The number of pages: 8
Approximate weight : 24 g (0.05 lbs)
Country: German technical standard
Category: Technical standards DIN
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit.
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