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Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures.
STANDARD published on 1.6.2012
Designation standards: DIN EN 62047-12:2012-06
Publication date standards: 1.6.2012
SKU: NS-239563
The number of pages: 31
Approximate weight : 93 g (0.21 lbs)
Country: German technical standard
Category: Technical standards DIN
Semiconductor devices in generalElectromechanical components in general
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 12: Verfahren zur Prüfung der Biege-Ermüdungsfestigkeit von Dünnschichtwerkstoffen unter Verwendung der Resonanzschwingungen bei MEMS-Strukturen.
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