Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB

Standard published on 28.7.2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
(Methodes d’essai pour les materiaux electriques, les cartes imprimees et autres structures d’interconnexion et ensembles – Partie 3-302: Detection des defauts de metallisation dans les cartes de circuits imprimes nus par tomographie informatisee (TI))

Standard published on 22.10.2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 3-719: Methodes d´essai pour les structures d´interconnexion (cartes imprimees) - Controles de la variation de resistance des trous metallises uniques (PTH) au cours des cycles de temperatures)

Standard published on 5.1.2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 3-913: Methodes d´essais pour la conductivite thermique des circuits imprimes pour les LED a forte luminosite)

Standard published on 5.1.2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

Standard published on 17.3.2017

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 3: Methodes d´essai des structures d´interconnexion (cartes imprimees))

Standard published on 9.10.2007

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 5-1: Methodes d´essai generales pour les materiaux et les assemblages - Lignes directrices pour les assemblages de cartes a circuit imprime)

Standard published on 5.7.2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 5-2: Methodes d´essai generales pour les materiaux et les assemblages - Flux de brasage pour les assemblages de cartes imprimees)

Standard published on 8.1.2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 5-3: Methodes d´essai des assemblages de cartes imprimees: Pate de brasage)

Standard published on 8.1.2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
(Methodes d’essai pour les materiaux electriques, les cartes imprimees et autres structures d’interconnexion et ensembles - Partie 5-301: Methodes d’essai generales pour les materiaux et les assemblages - Pate a braser a fines particules de brasage)

Standard published on 17.3.2021