Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
(Ensembles de cartes imprimees - Partie 1: Specification generique - Exigences relatives aux ensembles electriques et electroniques brases utilisant les techniques de montage en surface et associees)

Standard published on 14.9.2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Standard published on 14.9.2018

Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies

Standard published on 18.7.2022

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
(Ensembles de cartes imprimees - Partie 2: Specification intermediaire - Exigences relatives a l´assemblage par brasage pour montage en surface)

Standard published on 23.5.2017

Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Correction published on 16.9.2019

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
(Ensembles de cartes imprimees - Partie 3: Specification intermediaire - Exigences relatives a l´assemblage par brasage de trous traversants)

Standard published on 30.5.2017

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
(Ensembles de cartes imprimees – Partie 4: Specification intermediaire – Exigences relatives a l’assemblage de bornes par brasage)

Standard published on 26.7.2017

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
(Ensembles de cartes imprimees - Partie 6: Criteres d´evaluation des vides dans les joints brases des boitiers BGA et LGA et methode de mesure)

Standard published on 14.1.2010

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

Standard published on 11.3.2020

Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices

Standard published on 19.3.2021