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IEC – The company IEC is world-leading organization, which creates and issues International standards for all electrical, electronic and other related technologies known generally as electro-technologies. Wherever, there is electricity and electronics you can find the company IEC, which promotes the safety and performance, the environment, electrical energy efficiency and renewable energy. The company IEC also administers conformity assessment systems, which certify that the equipment, systems or components comply with International Standards of this company.
Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
(Corrigendum 2 - Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 11: Variations rapides de temperature - Methode des deux bains)
Correction published on 13.8.2003
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Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 12: Vibrations, frequences variables)
Standard published on 13.12.2017
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Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
(Dispositifs a seminconducteurs - Methodes d´essais mecaniques et climatiques - Partie 13: Atmosphere saline)
Standard published on 15.2.2018
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Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 14: Robustesse des sorties (integrite des connexions))
Standard published on 7.8.2003
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Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 15: Resistance a la temperature de brasage pour dispositifs par trous traversants)
Standard published on 14.7.2020
Selected format:Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Standard published on 14.7.2020
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Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 16: Detection de bruit d´impact de particules (PIND))
Standard published on 17.1.2003
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Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 17: Irradiation aux neutrons)
Standard published on 28.3.2019
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Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 18: Rayonnements ionisants (dose totale))
Standard published on 10.4.2019
Selected format:Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
Standard published on 10.4.2019
Selected format:Latest update: 2026-08-21 (Number of items: 2 298 377)
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