Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

WITHDRAWN published on 30.5.2003

Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere

WITHDRAWN published on 30.5.2003

Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices

WITHDRAWN published on 21.11.2003

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

WITHDRAWN published on 13.7.2011

Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

WITHDRAWN published on 21.11.2003

Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

WITHDRAWN published on 21.11.2003

Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

WITHDRAWN published on 11.6.2004

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

WITHDRAWN published on 6.10.2023

Semiconductor devices - Mechanical and climatic test methods -- Part 21: Solderability (Endorsed by AENOR in August of 2005.)

WITHDRAWN published on 12.5.2014

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

WITHDRAWN published on 15.4.2017