We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
                  Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials.
STANDARD published on 1.4.2014
    
        Designation standards: DIN EN 62047-18:2014-04
                
                
                
               
                Publication date standards:  1.4.2014
                  SKU:  NS-239566
          The number of pages: 15
Approximate weight : 45 g (0.10 lbs)
        Country:          German technical standard
        Category: Technical standards DIN
        
                
              
Semiconductor devices in generalElectromechanical components in general
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 18: Biegeprüfverfahren für Dünnschichtwerkstoffe.
1.7.2004
  WITHDRAWN
1.6.2011
1.9.2003
  WITHDRAWN
1.9.2003
  WITHDRAWN
1.9.2003
1.1.2011
      Do you want to make sure you use only the valid technical standards? 
      We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
     
      Would you like to know more? Look at this page.
    
Latest update:  2025-11-03 (Number of items: 2 242 248) 
© Copyright 2025 NORMSERVIS s.r.o.