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Standards IEC - International electro-technical commission - Page 394
IEC – The company IEC is world-leading organization, which creates and issues International standards for all electrical, electronic and other related technologies known generally as electro-technologies. Wherever, there is electricity and electronics you can find the company IEC, which promotes the safety and performance, the environment, electrical energy efficiency and renewable energy. The company IEC also administers conformity assessment systems, which certify that the equipment, systems or components comply with International Standards of this company.
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IEC 60749-18-ed.2.0
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Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 18: Rayonnements ionisants (dose totale))
Standard published on 10.4.2019
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IEC 60749-18-ed.2.0-RLV
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Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
Standard published on 10.4.2019
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IEC 60749-19-ed.1.0
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Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 19: Resistance de la pastille au cisaillement)
Standard published on 13.2.2003
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IEC 60749-19-ed.1.0/Amd.1
Change
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Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
(Amendement 1 - Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 19: Resistance de la pastille au cisaillement)
Change published on 28.7.2010
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IEC 60749-19-ed.1.1+Amd.1-CSV
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Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 19: Resistance de la pastille au cisaillement)
Standard published on 29.11.2010
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IEC 60749-2-ed.1.0
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Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 2: Basse pression atmospherique)
Standard published on 12.4.2002
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IEC 60749-2-ed.1.0/Cor.1
Correction
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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
(Corrigendum 1 - Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 2: Basse pression atmospherique)
Correction published on 12.8.2003
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IEC 60749-20-1-ed.2.0
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Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 20-1: Manipulation, emballage, etiquetage et transport des composants pour montage en surface sensibles a l´effet combine de l´humidite et de la chaleur de brasage)
Standard published on 26.6.2019
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IEC 60749-20-1-ed.2.0-RLV
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Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Standard published on 26.6.2019
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IEC 60749-20-ed.3.0
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 20 : Resistances des CMS a boitier plastique a l’effet combine de l’humidite et de la chaleur de brasage)
Standard published on 31.8.2020
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