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Standards IEC - International electro-technical commission - Page 394
IEC – The company IEC is world-leading organization, which creates and issues International standards for all electrical, electronic and other related technologies known generally as electro-technologies. Wherever, there is electricity and electronics you can find the company IEC, which promotes the safety and performance, the environment, electrical energy efficiency and renewable energy. The company IEC also administers conformity assessment systems, which certify that the equipment, systems or components comply with International Standards of this company.
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IEC 60749-2-ed.1.0
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Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 2: Basse pression atmospherique)
Standard published on 12.4.2002
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IEC 60749-2-ed.1.0/Cor.1
Correction
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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
(Corrigendum 1 - Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 2: Basse pression atmospherique)
Correction published on 12.8.2003
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IEC 60749-20-1-ed.2.0
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Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 20-1: Manipulation, emballage, etiquetage et transport des composants pour montage en surface sensibles a l´effet combine de l´humidite et de la chaleur de brasage)
Standard published on 26.6.2019
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IEC 60749-20-1-ed.2.0-RLV
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Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Standard published on 26.6.2019
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IEC 60749-20-ed.3.0
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 20 : Resistances des CMS a boitier plastique a l’effet combine de l’humidite et de la chaleur de brasage)
Standard published on 31.8.2020
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IEC 60749-20-ed.3.0-RLV
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Standard published on 31.8.2020
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IEC 60749-21-ed.3.0
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Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 21: Brasabilite)
Standard published on 9.12.2025
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IEC 60749-21-ed.3.0-RLV
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Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Standard published on 9.12.2025
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IEC 60749-22-1-ed.1.0
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Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods
(Dispositifs a semiconducteurs - Methodes d’essais mecaniques et climatiques - Partie 22-1: Robustesse des contacts soudes - Methodes d’essais d’arrachement par traction des contacts soudes par fil)
Standard published on 26.11.2025
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IEC 60749-22-2-ed.1.0
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Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
(Dispositifs a semiconducteurs - Methodes d’essais mecaniques et climatiques - Partie 22-2: Robustesse des contacts soudes - Methodes d’essais de cisaillement des contacts soudes par fil)
Standard published on 26.11.2025
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